GAP is a line of alluminum rugged Servers designed for applications that require a robust MIL-GRADE certified computing platform, suitable for operation in critical environments.
GAP S7 Series Rugged Servers feature single and dual socket 3rd Gen. Intel® Xeon® Scalable Processors (Ice Lake) offering a balanced architecture with built-in AI acceleration and advanced security capabilities, up to 4TB DDR4-3200 RAM, 64 lane PCIe Gen 4 per CPU, a 7% higher socket-to-socket bandwidth.
GAP S7 Series Rugged Servers are MIL-STD-810F qualified for temperature and shock, MIL-STD-167-1A for vibrations and can optionally conform to MIL-STD-461.
| CPU | 3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) max 270W TDP |
| Memory | Up to 4TB ECC RDIMM, DDR4-3200MHz; 16 DIMM slots |
| Chipset | Intel® C621A |
| Graphics | ASPEED AST2600 BMC |
| Network Connectivity | 1x Dedicated IPMI LAN port 2x GbE with RJ45 connectors (2 x 10GbE motherboard version available) |
| Storage | Internal: 1x M.2 NVMe; M-Key, 2280/22110 2x Disk on Module Removable: Up to 4x U.2 NVMe SSD or up to 6x 2.5” SATA / SAS SSD |
| TPM | 1 TPM Header |
| Motherboard I/O shield | Available on the front: 1x VGA, 1x COM, 4x USB 3.2, 2x GbE (10GbE); 1x IPMI |
| Expansion slots | 4x PCIe 4.0 x16 + 2x PCIe 4.0 x8 |
| Operative Systems | Windows® 10 IoT Enterprise 64bit, Windows® Server 2016 64bit; Windows® Server 2019 64bit; RHEL 8.4 64bit; Ubuntu 20.04.2 LTS SVR 64bit; CentOS 7.9 64bit |
| IPMI | IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications |
| Remote Monitoring | Monitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, raid health, and memory health) |
| Power Supply | AC Redundant Power Supply – Optional Single DC Redundant Power Supply – Optional Single |
| Dimensions (W x H x D) |
483 x 132 x 450mm |
| Material | Aluminum with surface passivation treatment |
| Colour | Black / RAL 9005 – Powder Coating |
| Mounting | 3U 19” rackmount chassis Optional Telescopic slides |
| Configuration | Front I/O – Front Power Supply |
| Front Panel Leds / Buttons | Power On/Off button with LED Reset button with LED |
| Drive Bays | 1 x 5.25” + 2 x 3.5” |
| Fans | 4x removable PWM fans |
| Dimensions (W x H x D) |
483 x 132 x 450mm |
| Material | Aluminum with surface passivation treatment |
| Colour | Black / RAL 9005 – Powder Coating |
| Mounting | 3U 19” rackmount chassis Optional Telescopic slides |
| Configuration | Front I/O – Front Power Supply |
| Front Panel Leds / Buttons | Power On/Off button with LED Reset button with LED |
| Drive Bays | 1 x 5.25” + 2 x 3.5” |
| Fans | 4x removable PWM fans |
| Operating Temperatures | 0°C to +50°C MIL-STD-810H, Method 501.7 & 502.7 -20°C to +60°C (depending on configuration) |
| Storage Temperature | -40°C to +70°C MIL-STD-810H, Method 501.7 & 502.7 |
| Humidity | 5% – 95% non-condensing MIL-STD-810H 507.6 |
| Operating Vibrations | MIL-STD-167-1A, Type I |
| Not Operating Vibrations | 1.17 Grms, 5-500 Hz MIL-STD-810H, Method 514.8 |
| Operating Shocks | 20g / 11ms – half sine MIL-STD-810G, Method 516.7 |
| EMC | Directive 2014/35/UE-LVD | Directive 2014/30/UE-EMC | Directive 2011/65/UE – RoHS Regulation EC No 1907/2006 | MIL-STD-461G (on request) |
2U – 510mm depth
Rear I/O – Rear Power Supply
6 FH PCIe Slots
9 Hot Swap SSD
2U – 510mm depth
Front I/O – Rear Power Supply
6 FH PCIe Slots
9 Hot Swap SSD
3U – 510mm depth
Rear I/O – Rear Power Supply
6 FH PCIe Slots
14 Hot Swap SSD
2U – 510mm depth
Rear I/O – Rear Power Supply
6 FH PCIe Slots
9 Hot Swap SSD
2U – 510mm depth
Front I/O – Rear Power Supply
6 FH PCIe Slots
9 Hot Swap SSD
3U – 510mm depth
Rear I/O – Rear Power Supply
6 FH PCIe Slots
14 Hot Swap SSD