GAP is a line of high performance rugged workstations designed for applications that require a robust and qualified MIL-GRADE device, suitable for operating in critical environments. Gen. 7 rugged workstations feature Intel® Xeon® E-2200/2100 or 8th/9th Gen. Intel® Core™ i7/i5/i3 (Coffee Lake) processors supporting up to 8 Cores (16 thread with Hyper-Threading), 16MB Smart Cache, up to 128GB DDR4 memory with or without ECC and up to 16 PCIe 3.0 lanes. The integrated IPMI services support monitoring, control, and management functions sending alarm notifications in case of critical events. GAP servers are MIL-STD-810F qualified for temperature and shock, MIL-STD-167-1A for vibrations and can optionally conform to MIL-STD-461.
| Processor | Intel® Xeon® E3-2200/2100, 8th/9th Gen. Intel® Core™ i7/i5/i3, Intel® Celeron® and Intel® Pentium® |
| Memory | Up to 128GB ECC/non-ECC UDIMM, DDR4-2666MHz |
| Chipset | Intel® C246 |
| Network | 1 x GbE LAN with Intel® i210-AT 1 x GbE LAN with Intel® I219lm |
| Storage | 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 |
| TPM | 1 TPM Header |
| Motherboard I/O | Available at the front: 1 x VGA (IPMI), 4 x USB 3.1, 2 x LAN, 1 x HDMI, 1 x DVI-D, 1 x DP, Audio |
| Expansion slots | 2 PCI-E 3.0 x16 (run at NA/16 o 8/8), 1 PCI-E 3.0 x4 (shared with M.2-M1) 1 PCI-E 3.0 x1 1 PCI 2 M.2 M-Key 1 U.2 (shared M.2-M2) |
| Operative Systems | Windows® 10 IoT Enterprise 2016, Windows® Server 2016, Windows® Server 2019, Linux |
| IPMI | IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications |
| Monitoring | Monitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, raid health, and memory health) |
| Power Supply | 100/240 Redundant VAC 18-36 Single or Redundant VDC 36-72 Single or Redundant VDC |
| Dimensions (W x D x H) |
483 x 510 x 133 mm |
| Construction | Aluminum with surface passivation treatment |
| Colour | Silver / RAL 9007 |
| Mounting | 3U 19” rackmount chassis Telescopic slides optional |
| Configuration | Front I/O and Power Supply |
| Front Panel | Led Power ON and SSD functionality; Power ON / OFF and System Reset; 2x USB 2.0 |
| Drive Bay | 1 x slim 5.25”; 1 x 3.5” bay + 1 x internal bay x 3 ODD 2.5” |
| Dimensions (W x D x H) |
483 x 510 x 133 mm |
| Construction | Aluminum with surface passivation treatment |
| Colour | Silver / RAL 9007 |
| Mounting | 3U 19” rackmount chassis Telescopic slides optional |
| Configuration | Front I/O and Power Supply |
| Front Panel | Led Power ON and SSD functionality; Power ON / OFF and System Reset; 2x USB 2.0 |
| Drive Bay | 1 x slim 5.25”; 1 x 3.5” bay + 1 x internal bay x 3 ODD 2.5” |
| Operating Temperatures | 0°C to +50°C MIL-STD-810H, Method 501.7 & 502.7 -20°C to +60°C (depending on configuration) |
| Storage Temperature | -40°C to +70°C MIL-STD-810H, Method 501.7 & 502.7 |
| Humidity | 5% – 95% non-condensing MIL-STD-810H 507.6 |
| Operating Vibrations | MIL-STD-167-1A, Type I |
| Not Operating Vibrations | 1.17 Grms, 5-500 Hz MIL-STD-810H, Method 514.8 |
| Operating Shocks | 20g / 11ms – half sine MIL-STD-810G, Method 516.7 |
| EMC | Directive 2014/35/UE-LVD | Directive 2014/30/UE-EMC | Directive 2011/65/UE – RoHS Regulation EC No 1907/2006 | MIL-STD-461G (on request) |
2U rack – 510mm depth
Front I/O – Front Power Supply
3U rack – 510mm depth
Rear I/O – Rear Power Supply
3U rack – 510mm depth
Front I/O – Rear Power Supply
2U rack – 510mm depth
Front I/O – Front Power Supply
3U rack – 510mm depth
Rear I/O – Rear Power Supply
3U rack – 510mm depth
Front I/O – Rear Power Supply