GAP-245F-W9 Series2U Rugged workstation with 14th generation Intel Core processor
GAP-245F-W9 is a rugged 2U 19-inch rack workstation with an aluminum chassis, front I/O, rear power input, and 14th/13th generation Intel Core processors, qualified to MIL-STD-810, MIL-STD-461, and MIL-STD-167-1A.
Overview
GAP is a family of rugged aluminum servers and workstations for edge applications requiring a MIL-GRADE certified computing platform for critical environments.
GAP W9 workstations use 14th/13th generation Intel® Core™ i9/i7/i5/i3 processors, delivering high performance, improved energy efficiency, and support for AI and high-speed connectivity. Integrated IPMI provides monitoring, control, and management, with alarm notification on critical events, for system integrity in remote environments.
GAP workstations meet MIL-STD-810F and MIL-STD-167-1A for shock, temperature, and vibration resistance, with optional MIL-STD-461 EMI/EMC compliance and MIL-grade connectors on power and I/O inputs.
System Features
3x M.2 PCIe 4.0 x4
Form Factor: 2280; M.2 Key: M-Key (RAID 0, 1, 5)
Removable:
Up to 3x 2.5” SAS SSD or
Up to 6x U.2 NVMe SSD or
Up to 9x 2.5” SATA SSD
1x RJ45 Gigabit Ethernet LAN ports
1x RJ45 2.5 Gigabit Ethernet LAN port
(available on the front panel)
DC Redundant Power Supply – Optional Single
Mechanical Features
Environmental Features
MIL-STD-810H, Method 501.7 Procedure II & 502.7 Procedure II (combined)
MIL-STD-810H, Method 501.7 Procedure III & 502.7 Procedure II (combined)
MIL-STD-810H, Method 507.6 Procedure II (aggravated)
Operating Vibrations: MIL-STD-167-1A, Type I, 4h per axis
Not Operating Vibrations: 1.17 Grms, 5-500 Hz – 60 min for each axis
Not Operating Vibrations: MIL-STD-810H, Method 514.8 Procedure I
Operating Shocks: 20g / 11ms – half-sine, functional shock three pulses on each direction
Operating Shocks: MIL-STD-810H, Method 516.8 Procedure I
The other configurations of GAP W9
Same platform, same spec sheet: form factor, socket and I/O are what change. Tick two and read them side by side.
Other platforms
Products from other series, suggested by our engineering office: they are another platform, not a configuration of this one.
Insights & Engineering Guides
Technical Guide5 min read
Conduction-Cooled vs Air-Cooled: Choosing the Right Thermal Solution
Sealed conduction-cooled systems eliminate ingress risk but require thermal interface planning. Air-cooled systems offer higher compute density. This guide helps you choose based on your platform constraints.
Read guide
Technical Guide7 min read
Edge AI in Military Platforms: Selecting the Right GPU Module
NVIDIA Jetson Orin vs discrete GPU cards vs FPGA accelerators — a decision framework for EO/IR, ISR and sensor fusion applications requiring onboard AI inference.
Read guide
Buying Guide5 min read
Long-Term Support and Obsolescence Management for Defence Electronics
Defence programmes run for 10–30 years. This guide covers what questions to ask about component lifecycle, configuration management, and how to evaluate a supplier’s long-term support commitment.
Read guide
Any Mission Starts with a Conversation.
At GOMA RUGGED SOLUTIONS, you talk to engineers - not salespeople. Tell us about your program requirements and we will identify the right platform, configuration and qualification path.