Overview

GAP is a line of rugged servers and workstations with aluminum construction, designed for applications that require a robust and qualified MIL-GRADE device, suitable for operating in critical environments.
G6 series rugged servers integrate a single or dual socket Intel Xeon Scalable Processors (Skylake-SP / Cascade Lake-SP), up to six memory channels, up to 48 PCIe 3.0 lines, integrated IPMI services. GAP servers are MIL-STD-810F qualified for temperature and shock, MIL-STD-167-1A for vibration and can optionally conform to MIL-STD-461.

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System Features

Processor Intel® Xeon® Scalable Processors Family – dual socket P (LGA 3647)
Memory Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz
Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz
Chipset Intel® C621
Network 2 x RJ45 Gigabit Ethernet
1 x RJ45 dedicated IPMI
Storage 2.5” SATA Disk – RAID 0, 1, 5, 10
TPM 1 TPM Header
Motherboard I/O Available at the rear: 1 x VGA, 4 x USB 3.0, 2 x GbE, 1 x IPMI
Expansion slots 2 x PCIe – Bracket Full Height
Operative Systems Windows® 8.1, Windows® 10 IoT Enterprise 2016, Windows® Server 2008 R2, Windows® Server 2012 R2, Linux, VmWare
IPMI IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications
Monitoring Monitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, raid health, and memory health)
Power Supply 100/240 Single or Redundant VAC
18-36 Single or Redundant VDC
36-72 Single or Redundant VDC
Mechanical Features

Dimensions
(W x D x H)
483 x 510 x 44,45 mm from angle 19” – 540 mm full depth
Construction Aluminum with surface passivation treatment
Colour Silver / RAL 9007
Mounting 1U 19” rackmount chassis
Telescopic slides optional
Configuration Rear I/O and Power Supply
Front Panel Led Power ON and SSD functionality; Power ON / OFF and System Reset; Connectors: 2 x USB 2.0
Drive Bay 1 x slim 5.25”; 2 x 3.5” bay + 1 x internal ODD 2.5”

Dimensions
(W x D x H)
483 x 510 x 44,45 mm from angle 19” – 540 mm full depth
Construction Aluminum with surface passivation treatment
Colour Silver / RAL 9007
Mounting 1U 19” rackmount chassis
Telescopic slides optional
Configuration Rear I/O and Power Supply
Front Panel Led Power ON and SSD functionality; Power ON / OFF and System Reset; Connectors: 2 x USB 2.0
Drive Bay 1 x slim 5.25”; 2 x 3.5” bay + 1 x internal ODD 2.5”
Environmental Features

Operating Temperatures 0°C to +50°C
MIL-STD-810H, Method 501.7 & 502.7
-20°C to +60°C (depending on configuration)
Storage Temperature -40°C to +70°C
MIL-STD-810H, Method 501.7 & 502.7
Humidity 5% – 95% non-condensing
MIL-STD-810H 507.6
Operating Vibrations MIL-STD-167-1A, Type I
Not Operating Vibrations 1.17 Grms, 5-500 Hz
MIL-STD-810H, Method 514.8
Operating Shocks 20g / 11ms – half sine
MIL-STD-810G, Method 516.7
EMC Directive 2014/35/UE-LVD | Directive 2014/30/UE-EMC | Directive 2011/65/UE – RoHS
Regulation EC No 1907/2006 | MIL-STD-461G (on request)
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