GAP is a line of rugged servers and workstations with aluminum construction, designed for applications that require a robust MIL-GRADE certified computing platform, suitable for operating in critical environments.
G5 series rugged Servers integrate single or dual socket Intel® Xeon® E5 v4 (Broadwell-EP) supporting up to 22 cores (44 threads with Hyper-Threading Technology), up to 55 MB of L3 cache per CPU, 2400MHz DDR4 up to 2TB and 40 PCIe lanes and IPMI services. GAP Servers are MIL-STD-810F qualified for temperature and shock, MIL-STD-167-1A for vibrations and can optionally conform to MIL-STD-461.
| Processor | Intel® Xeon® E5-2600 v4/v3 single or dual socket R3 (LGA 2011) |
| Memory | Up to 1TB 3DS ECC RDIMM, DDR4-2400MHz |
| Chipset | Intel® C612 |
| Network | 2 x RJ45 Gigabit Ethernet 1 x RJ45 dedicated IPMI |
| Storage | 2.5” SATA Disk – RAID 0, 1, 5, 10 |
| TPM | 1 TPM Header |
| Motherboard I/O | Available at the front: 1x COM; 1x VGA; 2x USB 3.0, 2x USB 2.0, 2x GbE, 1x IPMI |
| Expansion slots | Up to 6 PCIe Low Profile boards |
| Operative Systems | Windows® 7, Windows® 8.1, Windows® 10 IoT Enterprise 2016, Windows® Server 2008 R2, Windows® Server 2012 R2, Linux |
| IPMI | IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications |
| Monitoring | Monitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, raid health, and memory health) |
| Power Supply | AC Single Power Supply DC Single Power Supply |
| Dimensions (W x D x H) |
483 x 355 x 88 mm |
| Construction | Aluminum with surface passivation treatment |
| Colour | Silver / RAL 9006 |
| Mounting | 2U 19” rackmount chassis Telescopic slides optional |
| Configuration | Front I/O and Power Supply |
| Front Panel | Led Power ON and SSD functionality; Power ON / OFF and System Reset |
| Drive Bay | 1x slim 5.25” ; 1x 3.5” bay |
| Dimensions (W x D x H) |
483 x 355 x 88 mm |
| Construction | Aluminum with surface passivation treatment |
| Colour | Silver / RAL 9006 |
| Mounting | 2U 19” rackmount chassis Telescopic slides optional |
| Configuration | Front I/O and Power Supply |
| Front Panel | Led Power ON and SSD functionality; Power ON / OFF and System Reset |
| Drive Bay | 1x slim 5.25” ; 1x 3.5” bay |
| Operating Temperatures | 0°C to +50°C MIL-STD-810H, Method 501.7 & 502.7 -20°C to +60°C (depending on configuration) |
| Storage Temperature | -40°C to +70°C MIL-STD-810H, Method 501.7 & 502.7 |
| Humidity | 5% – 95% non-condensing MIL-STD-810H 507.6 |
| Operating Vibrations | MIL-STD-167-1A, Type I |
| Not Operating Vibrations | 1.17 Grms, 5-500 Hz MIL-STD-810H, Method 514.8 |
| Operating Shocks | 20g / 11ms – half sine MIL-STD-810G, Method 516.7 |
| EMC | Directive 2014/35/UE-LVD | Directive 2014/30/UE-EMC | Directive 2011/65/UE – RoHS Regulation EC No 1907/2006 | MIL-STD-461G (on request) |
2U rack – 450mm depth
Rear I/O – Rear Power Supply
Dual socket – Low profile boards
2U rack – 510mm depth
Rear I/O – Rear Power Supply
Dual socket
2U rack – 510mm depth
Front I/O – Rear Power Supply
Dual socket
2U rack – 450mm depth
Rear I/O – Rear Power Supply
Dual socket – Low profile boards
2U rack – 510mm depth
Rear I/O – Rear Power Supply
Dual socket
2U rack – 510mm depth
Front I/O – Rear Power Supply
Dual socket