GAP is a family of rugged servers and workstations with an aluminum construction, designed for applications that require a robust MIL-GRADE certified computing platform, suitable for operations in critical environments.
GAP-245P-S7-SOLO rugged servers feature single socket 3rd Gen. Intel® Xeon® Scalable Processors (Ice Lake), a balanced architecture that delivers built-in AI acceleration and advanced security capabilities and up to 64 lanes PCI Express Gen 4 per socket to enable higher I/O bandwidth per core.
GAP S7 SOLO series rugged servers are MIL-STD-810F qualified for temperature and shock, MIL-STD-167-1A for vibrations and can optionally conform to MIL-STD-461 for EMI/EMC.
| CPU | 3rd Gen Intel® Xeon® Scalable processors Single Socket LGA-4189 (Socket P+) max 205W TDP |
| Memory | Up to 2TB ECC RDIMM, DDR4-3200MHz; 8 DIMM slots |
| Chipset | Intel® C621A |
| Graphics | ASPEED AST2600 BMC |
| Network Connectivity | 1x Dedicated IPMI LAN port 2x 10 GbE ports |
| Storage | Internal: 1x M.2 NVMe; M-Key, 2280/22110 2x Disk on Module Up to 2x U.2 NVMe or 3x 2.5” SATA / SAS SSD |
| TPM | 1 TPM Header |
| Motherboard I/O shield | Available on the front: 1x COM; 1x IPMI LAN; 2x USB 2.0; 2x USB 3.2; 2x GbE; 1x VGA |
| Expansion slots | 2x PCI-E 4.0 x16 slot FHFL 2x PCI-E 4.0 x8 slot (Low profile) |
| Operative Systems | Windows® 10 IoT Enterprise 64bit, Windows® Server 2016 64bit; Windows® Server 2019 64bit; RHEL 8.4 64bit; Ubuntu 20.04.2 LTS SVR 64bit; CentOS 7.9 64bit |
| IPMI | IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications |
| Remote Monitoring | Monitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, raid health, and memory health) |
| Power Supply | AC Redundant Power Supply – Optional Single DC Redundant Power Supply – Optional Single |
| Dimensions (W x H x D) |
483 x 88 x 450 mm |
| Material | Aluminum with surface passivation treatment |
| Colour | Black / RAL 9005 – Powder Coating |
| Mounting | 2U 19” rackmount chassis Optional Telescopic slides |
| Configuration | Front I/O – Front Power Supply |
| Front Panel Leds / Buttons | Power On/Off button with LED Reset button with LED |
| Drive Bays | 1x 3.5” |
| Fans | 4x removable PWM fans |
| Dimensions (W x H x D) |
483 x 88 x 450 mm |
| Material | Aluminum with surface passivation treatment |
| Colour | Black / RAL 9005 – Powder Coating |
| Mounting | 2U 19” rackmount chassis Optional Telescopic slides |
| Configuration | Front I/O – Front Power Supply |
| Front Panel Leds / Buttons | Power On/Off button with LED Reset button with LED |
| Drive Bays | 1x 3.5” |
| Fans | 4x removable PWM fans |
| Operating Temperatures | 0°C to +50°C MIL-STD-810H, Method 501.7 & 502.7 -20°C to +60°C (depending on configuration) |
| Storage Temperature | -40°C to +70°C MIL-STD-810H, Method 501.7 & 502.7 |
| Humidity | 5% – 95% non-condensing MIL-STD-810H 507.6 |
| Operating Vibrations | MIL-STD-167-1A, Type I |
| Not Operating Vibrations | 1.17 Grms, 5-500 Hz MIL-STD-810H, Method 514.8 |
| Operating Shocks | 20g / 11ms – half sine MIL-STD-810G, Method 516.7 |
| EMC | Directive 2014/35/UE-LVD | Directive 2014/30/UE-EMC | Directive 2011/65/UE – RoHS Regulation EC No 1907/2006 | MIL-STD-461G (on request) |
1U – 510mm depth
Front I/O – Front Power Supply
2 FH + 1 LP PCIe Slots
3 Internal SSD
2U – 510mm depth
Rear I/O – Rear Power Supply
2 FH + 2 LP PCIe Slots
9 Hot Swap SSD
2U – 450mm depth
Front I/O – Rear Power Supply
2 FH + 2 LP PCIe Slots
9 Hot Swap SSD
1U – 510mm depth
Front I/O – Front Power Supply
2 FH + 1 LP PCIe Slots
3 Internal SSD
2U – 510mm depth
Rear I/O – Rear Power Supply
2 FH + 2 LP PCIe Slots
9 Hot Swap SSD
2U – 450mm depth
Front I/O – Rear Power Supply
2 FH + 2 LP PCIe Slots
9 Hot Swap SSD