GAP is a line of rugged servers and workstations with aluminum construction, designed for applications that require a robust MIL-GRADE certified computing platform, suitable for operating in critical environments.
G6 series rugged servers integrate a single or dual socket Intel® Xeon® Scalable Processors (Skylake-SP / Cascade Lake-SP), up to six memory channels, up to 48 PCIe 3.0 lines, integrated IPMI services. GAP servers are MIL-STD-810F qualified for temperature and shock, MIL-STD-167-1A for vibration and can optionally conform to MIL-STD-461.
| Processor | Intel® Xeon® Scalable Processors Family – dual socket P (LGA 3647) |
| Memory | Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz |
| Chipset | Intel® C621 |
| Network | 2 x RJ45 Gigabit Ethernet 1 x RJ45 dedicated IPMI |
| Storage | 2.5” SATA Disk – RAID 0, 1, 5, 10 |
| TPM | 1 TPM Header |
| Motherboard I/O | Available at the front: 1 x VGA, 4 x USB 3.0, 2 x GbE, 1 x IPMI |
| Expansion slots | 3 x PCIe – Bracket Full Height 2 x PCIe – Bracket Low profile |
| Operative Systems | Windows® 8.1, Windows® 10 IoT Enterprise 2016, Windows® Server 2008 R2, Windows® Server 2012 R2, Linux, VmWare |
| IPMI | IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications |
| Monitoring | Monitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, raid health, and memory health) |
| Power Supply | 100/240 Redundant VAC 18-36 Single or Redundant VDC 36-72 Single or Redundant VDC |
| Dimensions (W x D x H) |
483 x 510 x 88 mm |
| Construction | Aluminum with surface passivation treatment |
| Colour | Silver / RAL 9007 |
| Mounting | 2U 19” rackmount chassis Telescopic slides optional |
| Configuration | Front I/O and Rear Power Supply |
| Front Panel | Led Power ON and SSD functionality; Power ON / OFF and System Reset |
| Drive Bay | 1 x slim 5.25”; 1 x 3.5” bay + 1 x internal bay x 3 ODD 2.5” |
| Dimensions (W x D x H) |
483 x 510 x 88 mm |
| Construction | Aluminum with surface passivation treatment |
| Colour | Silver / RAL 9007 |
| Mounting | 2U 19” rackmount chassis Telescopic slides optional |
| Configuration | Front I/O and Rear Power Supply |
| Front Panel | Led Power ON and SSD functionality; Power ON / OFF and System Reset |
| Drive Bay | 1 x slim 5.25”; 1 x 3.5” bay + 1 x internal bay x 3 ODD 2.5” |
| Operating Temperatures | 0°C to +50°C MIL-STD-810H, Method 501.7 & 502.7 -20°C to +60°C (depending on configuration) |
| Storage Temperature | -40°C to +70°C MIL-STD-810H, Method 501.7 & 502.7 |
| Humidity | 5% – 95% non-condensing MIL-STD-810H 507.6 |
| Operating Vibrations | MIL-STD-167-1A, Type I |
| Not Operating Vibrations | 1.17 Grms, 5-500 Hz MIL-STD-810H, Method 514.8 |
| Operating Shocks | 20g / 11ms – half sine MIL-STD-810G, Method 516.7 |
| EMC | Directive 2014/35/UE-LVD | Directive 2014/30/UE-EMC | Directive 2011/65/UE – RoHS Regulation EC No 1907/2006 | MIL-STD-461G (on request) |
2U – 450mm depth
Front I/O – Front Power Supply
Dual socket – Low profile boards
2U – 510mm depth
Rear I/O – Rear Power Supply
Dual socket
2U – 510mm depth
Front I/O – Front Power Supply
Dual socket
2U – 450mm depth
Front I/O – Front Power Supply
Dual socket – Low profile boards
2U – 510mm depth
Rear I/O – Rear Power Supply
Dual socket
2U – 510mm depth
Front I/O – Front Power Supply
Dual socket