Overview

GAP is a line of high performance rugged Workstations designed for applications that require a robust and qualified MIL-GRADE device, suitable for operating in critical environments. Gen 6 rugged Workstations feature Intel Xeon E3-1200 v5/v6, 6th/7th Gen. Intel Core i7/i5/i3 (Kaby Lake / Sky Lake) processors supporting up to 4 Cores (8 thread with Hyper-Threading), 8MB Smart Cache, up to 64GB DDR4 memory with or without ECC and up to 16 PCIe 3.0 lanes. The integrated IPMI services support monitoring, control, and management functions sending alarm notifications in case of critical events. GAP Servers are MIL-STD-810F qualified for temperature and shock, MIL-STD-167-1A for vibrations and can optionally conform to MIL-STD-461.

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System Features

Processor Intel® Xeon® E3-1200 v5/v6, 6th/7th Gen. Intel® Core™ i7/i5/i3, Intel® Celeron® and Intel® Pentium®
Memory Up to 64GB ECC/non-ECC UDIMM, DDR4-2400MHz
Chipset Intel® C236
Network 1 x GbE LAN with Intel® i210-AT
1 x GbE LAN with Intel® I219lm
Storage 6 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
TPM 1 TPM Header
Motherboard I/O Available at the rear: 1 x VGA, 2 x USB 2.0, 2 x USB 3.0, 2 x LAN, 1 x HDMI, 1 x DVI, Audio
Expansion slots 3 PCI-E 3.0 x16 (run at 16/NA/16 or 16/8/8),
1 PCI-E 3.0 x1 (in x4)
1 5V PCI 32-bit slot
Interface M.2: 1 PCI-E 3.0 x4
Form Factor: 2242/2260/2280 – Key: M-Key
Operative Systems Windows® 7, Windows® 8.1, Windows® 10 IoT Enterprise 2016, Windows® Server 2008 R2, Windows® Server 2012 R2, Windows® Server 2016, Linux
IPMI IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications
Monitoring Monitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, raid health, and memory health)
Power Supply 100/240 Redundant VAC
18-36 Single or Redundant VDC
36-72 Single or Redundant VDC
Mechanical Features

Dimensions
(W x D x H)
483 x 510 x 133 mm
Construction Aluminum with surface passivation treatment
Colour Silver / RAL 9007
Mounting 3U 19” rackmount chassis
Telescopic slides optional
Configuration Rear I/O and Power Supply
Front Panel Led Power ON and SSD functionality; Power ON / OFF and System Reset; 2x USB 2.0
Drive Bay 1 x slim 5.25”; 5 x 3.5” bay + 1 x internal bay x 3 ODD 2.5”

Dimensions
(W x D x H)
483 x 510 x 133 mm
Construction Aluminum with surface passivation treatment
Colour Silver / RAL 9007
Mounting 3U 19” rackmount chassis
Telescopic slides optional
Configuration Rear I/O and Power Supply
Front Panel Led Power ON and SSD functionality; Power ON / OFF and System Reset; 2x USB 2.0
Drive Bay 1 x slim 5.25”; 5 x 3.5” bay + 1 x internal bay x 3 ODD 2.5”
Environmental Features

Operating Temperatures 0°C to +50°C
MIL-STD-810H, Method 501.7 & 502.7
-20°C to +60°C (depending on configuration)
Storage Temperature -40°C to +70°C
MIL-STD-810H, Method 501.7 & 502.7
Humidity 5% – 95% non-condensing
MIL-STD-810H 507.6
Operating Vibrations MIL-STD-167-1A, Type I
Not Operating Vibrations 1.17 Grms, 5-500 Hz
MIL-STD-810H, Method 514.8
Operating Shocks 20g / 11ms – half sine
MIL-STD-810G, Method 516.7
EMC Directive 2014/35/UE-LVD | Directive 2014/30/UE-EMC | Directive 2011/65/UE – RoHS
Regulation EC No 1907/2006 | MIL-STD-461G (on request)
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