GEN6 XRS 4U series features single or dual socket 2nd Gen Intel® Xeon® Scalable Processors ideal for highly intensive workloads and supporting a generous number of PCIe 3.0 lanes. The integrated IPMI services support monitoring, control, and management functions sending alarm notifications in case of critical events. XRS 4U Extreme Rugged Servers are suitable for 19” rack mounting. They have a 4U milled aluminium chassis design to provide superior resistance and are equipped with a MIL grade power input connector. XRS can host up to six full size PCIe boards including GPU, FPGA modules and any other powerful PCI Express board. The front panel includes an elapse timer, and a drive bay for up to three removable SSDs.
XRS Extreme Rugged Servers are qualified to meet MIL-STD-810G for temperature, shocks and vibrations, and conforms to MIL-STD-461 for EMI/EMC. Specific customer’s configurations can be delivered fully tested according to the selected MIL specs.
| CPU | 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP |
| Memory | Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; DDR4-2933MHz, in 8 DIMM slots |
| Chipset | Intel® C621 |
| Network Connectivity | 2x RJ45 Gigabit Ethernet LAN ports 1x RJ45 Dedicated IPMI LAN port |
| Serial | 1x COM Port (1 header) |
| USB | 4x USB 2.0 ports (2 rear + 2 via headers) 3x USB 3.2 Gen1 ports (2 via headers + 1 Type A) |
| Storage | 10 SATA3 (6Gbps) port |
| TPM | TPM Header |
| I/O connectors | 2x USB 2.0, 2x LAN, 1x IPMI, 1x VGA |
| Expansion slots | 2x PCIe 3.0 x16, 3x PCIe 3.0 x8, 1x PCIe 3.0 x4 (in x8 slot) M.2 Interface: 1 SATA/PCIe 3.0 x4, Form Factor: 2260, 2280; Key: M-Key |
| Operative Systems | Windows® 10 IoT Enterprise 2016, Windows® Server 2016, Linux, Vmware |
| IPMI | IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications |
| Remote Monitoring | Monitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, raid health, and memory health) |
| Power Input | AC or DC input single power supply with EMC Filter and MIL D38999 connector Optional AC or DC input redundant power supply |
| Dimensions (W x D x H) |
Width 483mm Height 177.8mm – 4U rack Depth 546mm (chassis body) |
| Material | Aluminum with surface passivation treatment |
| Weight | 25 Kg (depending on configuration) |
| Colour | Silver / other on request |
| Mounting | 4U 19” rackmount chassis with bridge handles Optional telescopic slides |
| Front Panel / Leds / Buttons / Connectors | Power ON Switch and led for power fail. 2x USB 3.0, Elapsed Time Indicator |
| Rear Panel / Leds / Buttons / Connectors | Power Input connector, fuses, ground; 6x Full size slots |
| Drive Bay | 1x 3.5” drive bay hosting up to 3x 2.5” SSD |
| Dimensions (W x D x H) |
Width 483mm Height 177.8mm – 4U rack Depth 546mm (chassis body) |
| Material | Aluminum with surface passivation treatment |
| Weight | 25 Kg (depending on configuration) |
| Colour | Silver / other on request |
| Mounting | 4U 19” rackmount chassis with bridge handles Optional telescopic slides |
| Front Panel / Leds / Buttons / Connectors | Power ON Switch and led for power fail. 2x USB 3.0, Elapsed Time Indicator |
| Rear Panel / Leds / Buttons / Connectors | Power Input connector, fuses, ground; 6x Full size slots |
| Drive Bay | 1x 3.5” drive bay hosting up to 3x 2.5” SSD |
| Operating Temperature | Standard: -5°C to +55°C according to MIL-STD-810G Change 1 (501.6 & 502.6) Extended: -20°C to +60°C (depending on configuration) |
| Storage Temperature | -40°C to +71°C according to MIL-STD-810G Change 1 (501.6 & 502.6) |
| Humidiity | 5% to 95% non-condensed according to MIL-STD-810G Change 1 (506.7 Procedure II) |
| Fungus | Conformal coating on request |
| Shock | 20g, 11ms functional shock on each direction, according to MIL-STD-810G Change 1 (516.7 Procedure I) 40g, 11ms crash hazard shock on each direction, according to MIL-STD-810G Change 1 (516.7 Procedure V) |
| Vibrations | Functional: MIL-STD-810G Change 1 (528.1, Procedure I – Surface Ship) |
| EMC/Electromagnetic Compatibility | According to MIL-STD-461G |
2nd Gen Intel Xeon Scalable Processors
3U-IP
2nd Gen Intel Xeon Scalable Processors
1U – 2U – 3U
Intel Xeon E5 Broadwell-EP
1U – 2U – 3U
2nd Gen Intel Xeon Scalable Processors
3U-IP
2nd Gen Intel Xeon Scalable Processors
1U – 2U – 3U
Intel Xeon E5 Broadwell-EP
1U – 2U – 3U