Edge AI
Mission Computer
A rugged, MIL-Spec AI embedded system delivering up to 157 TOPS in a 1.6 Kg fanless enclosure. Purpose-built for autonomous navigation, EO/IR processing and 360° situational awareness.
AIX Series
Edge AI Mission Computer for Autonomous and Sensor Fusion Applications
The AIX Series is a rugged, MIL-Spec AI embedded system delivering up to 157 TOPS in a 1.6 Kg fanless enclosure. Based on NVIDIA Jetson Orin NX with 1024 CUDA cores, 32 Tensor Cores and dual NVDLA v2 accelerators, it is purpose-built for autonomous navigation, EO/IR processing, hyperspectral sensor fusion and 360° situational awareness.
The conduction-cooled chassis enables full IP65 sealing for deployment in dust, rain, and salt-fog environments without filter maintenance. All I/O connectors are MIL circular and HD-BNC waterproof.
Qualified to RTCA/DO-160G and MIL-STD-810 for temperature, altitude, vibration and shock, with MIL-STD-461G EMC compliance and MIL-STD-704F / MIL-STD-1275D power input compatibility.
Models Available
Choose Your Configuration
157 TOPS AI Performance
NVIDIA Jetson Orin NX with 1024 CUDA cores, 32 Tensor Cores and dual NVDLA v2 accelerators. 16 GB LPDDR5 memory for demanding vision and inference pipelines.
Fanless Design
No external airflow required. Conduction-cooled chassis enables full IP65 sealing for deployment in dust, rain, and salt-fog environments without filter maintenance.
MIL I/O Architecture
3G-SDI + analogue video inputs, 2.5GbE + GbE, CAN Bus, RS-232/422/485, USB 3.2, discrete I/O, audio I/O - all on MIL circular and HD-BNC waterproof connectors.
DO-160G & MIL-STD Qualified
RTCA/DO-160G and MIL-STD-810 for temperature, altitude, vibration and shock. MIL-STD-461G (Aircraft/Army) EMC compliance. MIL-STD-704F / MIL-STD-1275D power input.
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Insights & Engineering Guides
Standards Guide
MIL-STD-461 EMC Compliance for Rugged Systems
Understanding conducted and radiated emissions limits, CS101/CS114/RS103 test methods, and how to work with your rugged computer supplier to ensure EMC compliance from day one.
Read MoreTechnical Guide
Conduction-Cooled vs Air-Cooled: Choosing the Right Thermal Solution
Sealed conduction-cooled systems eliminate ingress risk but require thermal interface planning. Air-cooled systems offer higher compute density. This guide helps you choose based on your platform constraints.
Read MoreTechnical Guide
MIL-STD-810 vs DO-160G: What’s the Difference?
Both standards address environmental ruggedness, but they target different domains. This guide explains the key test methods, applicability and what to ask your supplier.
Read MoreContact
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