GAP-251R-S8-SOLO Series
2U Rugged Edge Server
5th / 4th Gen Intel® Xeon® Scalable Processors
SingleSocket
510mmDepth
RearI/O
RearPSU
Overview
GAP is a product family of Rugged aluminium Servers and Workstations designed for Edge applications that require a robust MIL-GRADE certified computing platform, suitable for operations in critical environments.
The GAP S8 Series Rugged Edge Servers are powered by single and dual socket 5th / 4th Gen Intel® Xeon® Scalable Processors, renowned for their robust architecture with enhanced AI acceleration and advanced security capabilities. Offering improved performance and efficiency, these servers are tailored to meet the demanding requirements of modern computing environments at the Edge.
The integrated IPMI services support monitoring, control, and management functions, sending alarm notifications in case of critical events.
Built to meet MIL-STD-810F standards for temperature and shock resistance, as well as MIL-STD-167-1A standards for vibration tolerance, GAP Rugged Edge Servers ensure reliable operation under the challenging conditions often found at the Edge. Additionally, they can optionally be configured to comply with MIL-STD-461 standards for EMI/EMC, featuring MIL-grade connectors for either the power input or both the I/O connectors and power supply inputs.
System Features
CPU5th Gen Intel® Xeon®/ 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP Up to 270W TDP
MemoryUp to 2TB ECC RDIMM, DDR5-4800MT/s in 8 DIMM slots
ChipsetIntel® C741
Graphics1 Aspeed AST2600 BMC port
Network Connectivity1x Dedicated IPMI LAN port
2x 10GbE with RJ45 connectors
2x 10GbE with RJ45 connectors
StorageOn Board:
1x M.2 NVMe; M-Key, 2280/22110
2x SATA Disk on Module
Internal:
Up to 1x 2.5” NVMe U.2 / SATA / SAS
Removable:
Up to 3x 2.5” SAS SSD or
Up to 6x U.2 NVMe SSD or
Up to 9x 2.5” SATA SSD
1x M.2 NVMe; M-Key, 2280/22110
2x SATA Disk on Module
Internal:
Up to 1x 2.5” NVMe U.2 / SATA / SAS
Removable:
Up to 3x 2.5” SAS SSD or
Up to 6x U.2 NVMe SSD or
Up to 9x 2.5” SATA SSD
TPM1x TPM Header
Motherboard I/O shield1x VGA, 2x USB 3.2, 2x USB 2.0, 2x 10GbE, 1x IPMI, 1x COM (available on the rear panel)
Expansion slots2x PCIe 5.0 x16 slots, FHFL
2x PCIe 5.0 x8 slots, LP
2x PCIe 5.0 x8 slots, LP
Operative SystemsWindows® 11 IoT Enterprise, Windows® 10 IoT Enterprise LTSC, Windows® Server 2022, Windows® Server 2019, Linux
IPMIIPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications
Remote MonitoringMonitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure, power consumption, disk health, RAID health, and memory health)
Power SupplyAC or DC Redundant Power Supply – Optional AC Single
Mechanical Features
Dimensions
(W x H x D)483 x 88 x 510 mm
540 mm full depth
(W x H x D)483 x 88 x 510 mm
540 mm full depth
MaterialAluminum with surface passivation treatment
ColourBlack / RAL 9005 – Powder Coating
Mounting2U 19” rackmount chassis
Optional Telescopic slides
Optional Telescopic slides
ConfigurationRear I/O – Rear Power Supply
Front Panel Leds / ButtonsPower On/Off button with LED
Reset button with LED
2x USB 3.0
Reset button with LED
2x USB 3.0
Fans3x internal PWM fans
Environmental Features
Operating Temperatures0°C to +50°C
MIL-STD-810H, Method 501.7 & 502.7
-20°C to +60°C (depending on configuration)
MIL-STD-810H, Method 501.7 & 502.7
-20°C to +60°C (depending on configuration)
Storage Temperature-40°C to +70°C
MIL-STD-810H, Method 501.7 & 502.7
MIL-STD-810H, Method 501.7 & 502.7
Humidity5% – 95% non-condensing
MIL-STD-810H 507.6
MIL-STD-810H 507.6
Operating VibrationsMIL-STD-167-1A, Type I
Not Operating Vibrations1.17 Grms, 5-500 Hz
MIL-STD-810H, Method 514.8
MIL-STD-810H, Method 514.8
Operating Shocks20g / 11ms – half sine
MIL-STD-810G, Method 516.7
MIL-STD-810G, Method 516.7
EMCDirective 2014/35/UE-LVD | Directive 2014/30/UE-EMC |
Directive 2011/65/UE – RoHS
Regulation EC No 1907/2006 | MIL-STD-461G (on request)
Directive 2011/65/UE – RoHS
Regulation EC No 1907/2006 | MIL-STD-461G (on request)
From the Blog
Insights & Engineering Guides
Buying Guide
How to Specify a Rugged Computer for Defence
A practical framework for defence engineers to define the right operating temperature range, mechanical envelope, power budget, I/O requirements and qualification standards before issuing an RFQ.
Read MoreTechnical Guide
Conduction-Cooled vs Air-Cooled: Choosing the Right Thermal Solution
Sealed conduction-cooled systems eliminate ingress risk but require thermal interface planning. Air-cooled systems offer higher compute density. This guide helps you choose based on your platform constraints.
Read MoreQualification Guide
From Prototype to Qualification: The MIL-STD Programme Timeline
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Contact
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