GAP-235PL-W8 Series
2U Rugged Workstation
10th/11th Gen Intel® Core™ & Xeon® W Processors
SingleSocket
355mmDepth
FrontI/O
FrontPSU
Overview
GAP is a line of high performance rugged Workstations designed for applications that require a robust MIL-GRADE certified computing platform, suitable for operating in critical environments. W8 Series rugged Workstations feature Intel® Xeon® E-2300, Intel® Xeon® W-1300 and 10th/11th Gen. Intel® Core™ (Rocket Lake) processors supporting up to 8 Cores (16 thread with Hyper-Threading), 16MB Smart Cache, up to 128GB DDR4 memory with or without ECC and up to 20 PCIe 4.0 lanes.
The integrated IPMI services support monitoring, control, and management functions sending alarm notifications in case of critical events. GAP Workstations are MIL-STD-810F qualified for temperature and shock, MIL-STD-167-1A for vibrations and can optionally conform to MIL-STD-461.
System Features
CPUIntel® Xeon® W-1300 11th Generation Intel® Core™ i9/i7/i5; 10th Generation Intel® Core™ i9/i7/i5/i3 – Single Socket LGA-1200 (Socket H5) supported; CPU TDP supports up to 125W TDP
MemoryUp to 128GB Unbuffered ECC/non-ECC UDIMM, DDR4-3200MHz, in 4 DIMM slots
ChipsetIntel® W580
GraphicsASPEED AST2500 BMC
Network Connectivity1x RJ45 Gigabit Ethernet Intel® Ethernet i225LM
1x RJ45 Gigabit Ethernet Intel® PHY I219LM for AMT/vPro
Dedicated LAN for IPMI
1x RJ45 Gigabit Ethernet Intel® PHY I219LM for AMT/vPro
Dedicated LAN for IPMI
StorageInternal:
1x M.2 PCIe 4.0 x4
2x M.2 PCIe 3.0 x4
Form Factor: 2280/22110; M.2 Key: M-Key
Removable:
Up to 2x U.2 NVMe SSD or up to 3x 2.5” SAS / SATA SSD
1x M.2 PCIe 4.0 x4
2x M.2 PCIe 3.0 x4
Form Factor: 2280/22110; M.2 Key: M-Key
Removable:
Up to 2x U.2 NVMe SSD or up to 3x 2.5” SAS / SATA SSD
TPM1 TPM Header
Motherboard I/O shieldAvailable on the rear: 1x DP port, 1x HDMI, 1x VGA, 1x DVI-D, 1x GbE LAN, 1x 2.5GHz GbE LAN, 1x IPMI, 4x USB 3.2, 1x USB-C, Audio
Expansion slots2x PCIe 4.0 x16 slots (16/NA or 8/8)
2x PCIe 3.0 x1
1x 5V PCI 32bit
2x PCIe 3.0 x1
1x 5V PCI 32bit
Operative SystemsMicrosoft Windows 10 IOT Enterprise; Microsoft Windows 11 IOT Enterprise; Microsoft Windows Server 2022; Debian Linux 11 (64-bit); Ubuntu Linux 18.04 LTS Server Edition (64-bit); Ubuntu Linux 20.04 LTS Server Edition (64-bit); Red Hat® Enterprise Linux® 8 Server
IPMIIPMI 2.0, SPM, Watchdog, SNMP and e-mail alarms and notifications
Remote MonitoringChecking system functionality (fan speeds, temperature, voltage, power supply, power consumption, disk health, memory
health, and RAID health)
health, and RAID health)
Power SupplyAC Single Power Supply
DC Single Power Supply
DC Single Power Supply
Mechanical Features
Dimensions
(W x H x D)483 x 88 x 355 mm
(W x H x D)483 x 88 x 355 mm
MaterialAluminum with surface passivation treatment
ColourBlack / RAL 9005 – Powder Coating
Mounting1U 19” rackmount chassis
Optional Telescopic slides
Optional Telescopic slides
ConfigurationFront I/O – Front Power Supply
Front Panel Leds / ButtonsPower On/Off button with LED
Reset button with LED
Reset button with LED
Drive Bays1x 3.5” + slim DVD bay
Fans4x removable PWM fans
Environmental Features
Operating Temperatures0°C to +50°C
MIL-STD-810H, Method 501.7 & 502.7
-20°C to +60°C (depending on configuration)
MIL-STD-810H, Method 501.7 & 502.7
-20°C to +60°C (depending on configuration)
Storage Temperature-40°C to +70°C
MIL-STD-810H, Method 501.7 & 502.7
MIL-STD-810H, Method 501.7 & 502.7
Humidity5% – 95% non-condensing
MIL-STD-810H 507.6
MIL-STD-810H 507.6
Operating VibrationsMIL-STD-167-1A, Type I
Not Operating Vibrations1.17 Grms, 5-500 Hz
MIL-STD-810H, Method 514.8
MIL-STD-810H, Method 514.8
Operating Shocks20g / 11ms – half sine
MIL-STD-810G, Method 516.7
MIL-STD-810G, Method 516.7
EMCDirective 2014/35/UE-LVD | Directive 2014/30/UE-EMC | Directive 2011/65/UE – RoHS
Regulation EC No 1907/2006 | MIL-STD-461G (on request)
Regulation EC No 1907/2006 | MIL-STD-461G (on request)
From the Blog
Insights & Engineering Guides
Technical Guide
MIL-STD-810 vs DO-160G: What’s the Difference?
Both standards address environmental ruggedness, but they target different domains. This guide explains the key test methods, applicability and what to ask your supplier.
Read MoreTechnical Guide
Conduction-Cooled vs Air-Cooled: Choosing the Right Thermal Solution
Sealed conduction-cooled systems eliminate ingress risk but require thermal interface planning. Air-cooled systems offer higher compute density. This guide helps you choose based on your platform constraints.
Read MoreBuying Guide
How to Specify a Rugged Computer for Defence
A practical framework for defence engineers to define the right operating temperature range, mechanical envelope, power budget, I/O requirements and qualification standards before issuing an RFQ.
Read More
Contact
Any Mission Starts with a Conversation.
At GOMA Rugged Solutions, you talk to engineers - not salespeople. Tell us about your program requirements and we will identify the right platform, configuration and qualification path.