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Home/Solutions/GAP/S9/GAP-247R-S9 Series

GAP-247R-S9 Series

2U Dual Socket Rugged Edge Server

6th Gen Intel® Xeon® Processors

GAP-247R-S9_hero
DualSocket
470mmDepth
RearI/O
RearPSU

Overview

GAP is a product family of rugged aluminium Servers and Workstations designed for edge applications that require a robust MIL-grade certified computing platform, suitable for operations in critical environments.

The GAP S9 series rugged edge servers are equipped with dual-socket 6 Intel® Xeon® 6 Scalable Processors optimized to deliver new levels of performance across the greatest range of workloads, while offering improved efficiency and lower power consumption.

With an innovative modular x86 architecture, the Intel Xeon 6 family supports two distinct CPU microarchitectures: Performance-cores (P-cores) deliver outstanding performance across diverse workloads, ideal for AI and HPC applications, while Efficient cores (E-cores) offer high core density and excellent performance per watt.

Built to meet MIL-STD-810F standards for temperature and shock resistance, as well as MIL-STD-167-1A standards for vibration tolerance, GAP rugged edge servers ensure reliable operation under the challenging conditions often found at the edge. Additionally, they can optionally be configured to comply with MIL-STD-461 standards for EMI/EMC, featuring MIL-grade connectors for either the power input or both the I/O connectors and power supply inputs.

System Features

S9-System_Features
CPUDual Intel® Xeon® 6700/6500-Series Processors with P-Cores
and Intel® Xeon® 6700-Series Processors with E-Cores (in LGA 4710 Socket E2) with three UPIs (24 GT/s max.) and a thermal design power (TDP) up to 270W.
MemoryUp to 4TB Registered DIMM, DDR5 6400MT/s in 16 DIMM slots
ChipsetSoC
Graphics1x ASPEED AST2600 BMC
Network Connectivity1x Dedicated IPMI LAN port
2x 10GbE ports supported by Broadcom 57416
StorageInternal:
2x PCIe 5.0 x4 NVMe M.2 slots
M-Key 2280 and 22110 form factors
Removable:
Up to 6x U.2 NVMe SSD or
Up to 9x 2.5” SATA SSD
TPM1x TPM Header
Motherboard I/O shield2x 10 GbE LAN, 1x BMC LAN, 4x USB 3.0, VGA, COM (available on the rear panel)
Expansion slots2x PCIe 4.0 x16 – 2x FHFL
Operative SystemsWindows® 11 IoT Enterprise, Windows® 10 IoT Enterprise, Windows® Server 2025, Windows® Server 2022, Linux
IPMIIPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications
Remote MonitoringMonitoring, control, and management functions (fan speed, temperature, voltage, redundant power failure,
power consumption, disk health, RAID health, and memory health)
Power SupplyAC or DC Redundant Power Supply – Optional AC Single

Mechanical Features

Dimensions
(W x H x D)
483 x 88 x 470 mm
MaterialAluminum with surface passivation treatment
ColourBlack / RAL 9005 – Powder Coating
Mounting2U 19” rackmount chassis
Optional Telescopic slides
ConfigurationRear I/O – Rear Power Supply
Front Panel Leds / ButtonsPower On/Off button with LED
Reset button with LED – 2x USB 3.0
Fans6x 40mm heavy duty fans
GAP-247R-S9 Series – 2U Dual Socket Rugged Edge Server mechanical features

Environmental Features

S9-Environmental_Features
Operating Temperatures0°C to +50°C
MIL-STD-810H, Method 501.7 & 502.7
Storage Temperature-40°C to +70°C
MIL-STD-810H, Method 501.7 & 502.7
Humidity5% – 95% non-condensing
MIL-STD-810H 507.6
Operating VibrationsMIL-STD-167-1A, Type I
Not Operating Vibrations1.17 Grms, 5-500 Hz
MIL-STD-810H, Method 514.8
Operating Shocks20g / 11ms – half sine
MIL-STD-810G, Method 516.7
EMCDirective 2014/35/UE-LVDC
Directive 2014/30/UE-EMC
Directive 2011/65/UE – RoHS
Regulation EC No 1907/2006
MIL-STD-461G (on request)
From the Blog

Insights & Engineering Guides

How to Specify a Rugged Computer for Defence
Buying Guide

How to Specify a Rugged Computer for Defence

A practical framework for defence engineers to define the right operating temperature range, mechanical envelope, power budget, I/O requirements and qualification standards before issuing an RFQ.

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Conduction-Cooled vs Air-Cooled: Choosing the Right Thermal Solution
Technical Guide

Conduction-Cooled vs Air-Cooled: Choosing the Right Thermal Solution

Sealed conduction-cooled systems eliminate ingress risk but require thermal interface planning. Air-cooled systems offer higher compute density. This guide helps you choose based on your platform constraints.

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Understanding ITAR-Free and EU Supply Chain in Defence Electronics
Procurement Guide

Understanding ITAR-Free and EU Supply Chain in Defence Electronics

For European programmes, supply chain sovereignty matters. This guide covers what ITAR-free means in practice, why EU-manufactured electronics provide procurement advantages, and what to look for in a supplier.

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Contact

Any Mission Starts with a Conversation.

At GOMA Rugged Solutions, you talk to engineers - not salespeople. Tell us about your program requirements and we will identify the right platform, configuration and qualification path.

gomarugged@goma.it
+39 011 7725024
Strada Antica di Collegno 225
10146 Torino (TO), Italy

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